Isesengura rya chip chip,ICchip ihuza imiyoboro ntishobora kwirinda kunanirwa mugikorwa cyiterambere, umusaruro no gukoresha.Hamwe nogutezimbere ibyifuzo byabantu kubwiza bwibicuruzwa no kwizerwa, umurimo wo gusesengura kunanirwa uragenda urushaho kuba ingenzi.Binyuze mu isesengura rya chip, IC chip yabashushanyije irashobora kubona inenge mugushushanya, kudahuza ibipimo bya tekiniki, gushushanya no gukora nabi, nibindi. Akamaro ko gusesengura kunanirwa kugaragara cyane muri:
Muburyo burambuye, akamaro nyamukuru kaICisesengura rya chip ryerekanwe mubice bikurikira:
1. Isesengura ryananiwe nuburyo bwingenzi nuburyo bwo kumenya uburyo bwo kunanirwa kwa chip ya IC.
2. Isesengura ryamakosa ritanga amakuru akenewe mugupima neza amakosa.
3. Isesengura ryananiranye ritanga injeniyeri yubushakashatsi hamwe nogutezimbere no kunoza igishushanyo cya chip kugirango uhuze ibikenewe mubishushanyo mbonera.
4. Isesengura ryananiwe rishobora gusuzuma imikorere yuburyo butandukanye bwikizamini, gutanga inyongera zikenewe mugupima umusaruro, no gutanga amakuru akenewe mugutezimbere no kugenzura inzira yikizamini.
Intambwe nyamukuru nibiri mu gusesengura kunanirwa:
Gupakurura imiyoboro yumuzunguruko: Mugihe ukuraho uruziga rwuzuye, komeza ubusugire bwimikorere ya chip, komeza upfe, udupapuro, inkwano ndetse na gurş-frame, hanyuma witegure ubutaha bwo gusesengura chip itemewe.
Mirror SEM yogusuzuma indorerwamo / EDX isesengura ryibigize: isesengura ryimiterere yibintu / kwitegereza inenge, isesengura risanzwe rya micro-agace k'ibigize ibice, gupima neza ingano y'ibigize, nibindi.
Test Ikizamini: Ikimenyetso cyamashanyarazi imbere muriICirashobora kuboneka vuba kandi byoroshye binyuze muri micro-probe.Lazeri: Micro-laser ikoreshwa mugukata agace kihariye ka chip cyangwa insinga.
Ection EMMI gutahura: EMMI microscope ntoya-ni igikoresho cyo gusesengura amakosa yo mu rwego rwo hejuru, gitanga uburyo bukomeye kandi butangiza ibintu.Irashobora gutahura no gutandukanya luminescence idakomeye cyane (igaragara kandi hafi-ya-infragre) kandi igafata imiyoboro yamenetse iterwa nubusembwa hamwe nibidasanzwe mubice bitandukanye.
Application Porogaramu ya OBIRCH (laser beam-iterwa na impedance agaciro ko guhindura agaciro): OBIRCH ikoreshwa kenshi murwego rwo hejuru-impedance nisesengura rito imbere ICchip, n'umurongo wo gusesengura inzira.Ukoresheje uburyo bwa OBIRCH, inenge zumuzunguruko zirashobora kuboneka neza, nkumwobo mumirongo, umwobo munsi unyuze mu mwobo, hamwe n’ahantu harwanya cyane munsi yu mwobo.Ibyiyongereyeho.
Screen LCD ya ecran yerekana ahantu hashyushye: Koresha ecran ya LCD kugirango umenye gahunda ya molekuline na reorganisation aho imeneka ya IC, hanyuma werekane ishusho imeze nk'ahantu hatandukanye n'utundi turere munsi ya microscope kugirango ubone aho imeneka (point point irenze 10mA) bizatera ikibazo uwashizeho isesengura nyirizina.Gukosora-ingingo-idakosowe-gusya-gusya: gukuramo ibishishwa bya zahabu byatewe kuri Pad ya chip ya shoferi ya LCD, kugirango Pad yangiritse rwose, ibyo bikaba bifasha gusesengura nyuma no kwisubiraho.
Testing X-Ray ibizamini bidasenya: Menya inenge zitandukanye muri ICipaki ya chip, nko gutobora, guturika, ubusa, ubunyangamugayo, PCB irashobora kugira inenge mubikorwa byo gukora, nko guhuza nabi cyangwa ikiraro, imiyoboro ifunguye, umuzunguruko mugufi cyangwa ibintu bidasanzwe Inenge zifitanye isano, ubusugire bwimipira yabagurisha mubipaki.
◆ SAM (SAT) ultrasonic flaw detection irashobora kutangiza ibyubaka imiterere imbereICipaki ya chip, kandi igaragaze neza ibyangiritse bitandukanye biterwa nubushuhe nubushyuhe bwumuriro, nka O wafer hejuru yo gusiba, O imipira yabagurisha, wafer cyangwa ibyuzuzo Hariho icyuho mubikoresho byo gupakira, imyenge imbere mubikoresho bipakira, ibyobo bitandukanye nka wafer ihuza ubuso , imipira yo kugurisha, kuzuza, nibindi
Igihe cyo kohereza: Nzeri-06-2022