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UBWOKO GUSOBANURIRA
Icyiciro Inzira zuzuye (IC)  Byashyizwemo  FPGAs (Field Programmable Gate Array)
Mfr Intel
Urukurikirane *
Amapaki Gariyamoshi
Ububiko busanzwe 24
Imiterere y'ibicuruzwa Bikora
Umubare wibicuruzwa shingiro EP4SE360

Intel igaragaza amakuru ya chip ya 3D: ishoboye gutondekanya miliyari 100 za tristoriste, irateganya gushyira mu 2023

Chip igizwe na 3D nicyerekezo gishya cya Intel cyo guhangana n amategeko ya Moore mugushyira ibice bya logique muri chip kugirango byongere cyane ubucucike bwa CPU, GPUs, hamwe na AI.Hamwe na chip inzira yegereje guhagarara, iyi ishobora kuba inzira yonyine yo gukomeza kunoza imikorere.

Vuba aha, Intel yerekanye ibisobanuro bishya byubushakashatsi bwa 3D Foveros bwa chip ya Lake Meteor Lake, Arrow Lake, na Lunar Lake chip mu nama yinganda za semiconductor inganda zishyushye 34.

Ibihuha biherutse kwerekana ko ikiyaga cya Meteor cya Intel kizatinda kubera gukenera guhindura GPU tile / chipset ya Intel kuva TSMC 3nm kuri node ya 5nm.Mu gihe Intel itarasangira amakuru ajyanye na node yihariye izakoresha kuri GPU, uhagarariye isosiyete yavuze ko ihuriro ryateganijwe ku bice bya GPU ridahindutse kandi ko utunganya ibintu biri mu nzira yo gusohora ku gihe mu 2023.

Ikigaragara ni uko iki gihe Intel izatanga gusa kimwe mu bice bine (igice cya CPU) gikoreshwa mu kubaka chipi yacyo ya Meteor - TSMC izatanga ibindi bitatu.Inkomoko yinganda zerekana ko tile ya GPU ari TSMC N5 (inzira ya 5nm).

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Intel yasangiye amashusho agezweho ya Meteor Lake itunganya, izakoresha Intel ya 4 ya node (7nm inzira) kandi izabanza kugera ku isoko nka progaramu ya mobile igendanwa hamwe na core esheshatu nini na core ebyiri nto.Ikiyaga cya Meteor Lake na Arrow Lake gikenera ibikenerwa ku masoko ya PC igendanwa na desktop, mu gihe ikiyaga cya Lunar kizakoreshwa mu ikaye yoroheje kandi yoroheje, ikubiyemo isoko rya 15W no munsi y’isoko.

Iterambere mu gupakira no guhuza rihindura byihuse isura yabatunganya kijyambere.Byombi ubu bifite akamaro nkibikorwa byibanze byikoranabuhanga - kandi twavuga ko ari ngombwa muburyo bumwe.

Kuri uyu wa mbere, byinshi Intel yatangaje kuri Intel byibanze ku ikoranabuhanga ryayo ryo gupakira 3D Foveros, rizakoreshwa nk'ishingiro ry’ikiyaga cya Meteor, Ikiyaga cya Arrow, na Lunar Lake itunganya isoko ry’umuguzi.Iri koranabuhanga ryemerera Intel gutondekanya uduce duto duto kuri chip ihuriweho hamwe na Foveros ihuza.Intel kandi ikoresha Foveros kubikoresho byayo bya Ponte Vecchio na Rialto Bridge GPUs na Agilex FPGAs, kuburyo ishobora gufatwa nkikoranabuhanga rishingiye kubicuruzwa byinshi bizakurikiraho.

Intel yabanje kuzana Foveros ya 3D kumasoko kubitunganya bito bito bya Lakefield, ariko ikiyaga cya Meteor 4-tile na Ponte Vecchio ya tile hafi 50 ni chip ya mbere yikigo cyakozwe cyane hamwe nikoranabuhanga.Nyuma ya Arrow Lake, Intel izahindukira mumikoranire mishya ya UCI, izayemerera kwinjira muri chipset ecosystem ikoresheje interineti isanzwe.

Intel yatangaje ko izashyira chipeti enye za Meteor Lake (bita "tile / tile" mu mvugo ya Intel) hejuru ya pasiporo ya Foveros intera intera / base tile.Ikibanza fatizo mu kiyaga cya Meteor gitandukanye nicyo muri Lakefield, gishobora gufatwa nka SoC muburyo bumwe.Ubuhanga bwo gupakira 3D Foveros nabwo bushigikira urwego rwimikorere.Intel ivuga ko ikoresha igiciro gito kandi gifite ingufu nke zashyizwe mubikorwa 22FFL (kimwe na Lakefield) kugirango ikore Foveros interposer layer.Intel kandi itanga 'Intel 16 ′ ivuguruye yiyi node kuri serivisi zayo, ariko ntibisobanutse neza verisiyo ya base ya Meteor Lake tile Intel izakoresha.

Intel izashyiraho modules ya compte, I / O bloks, SoC bloks, hamwe nubushushanyo mbonera (GPUs) ukoresheje Intel 4 kuriyi nzira yo hagati.Ibi bice byose byateguwe na Intel kandi bigakoresha ubwubatsi bwa Intel, ariko TSMC izakora OEM I / O, SoC, na GPU muri zo.Ibi bivuze ko Intel izatanga gusa CPU na Foveros.

Inkomoko yinganda zimeneka ko I / O bapfa na SoC bikozwe kuri N6 ya TSMC, mugihe tGPU ikoresha TSMC N5.(Birakwiye ko tumenya ko Intel yerekeza kuri I / O tile nka 'I / O Expander', cyangwa IOE)

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Ibihe bizaza kumurongo wa Foveros harimo 25 na 18-micron.Intel ivuga ko bishoboka ko bishoboka no kugera kuri 1-micron bump intera mugihe kizaza ukoresheje Hybrid Bonded Interconnects (HBI).

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