Ibirango bishya byukuri byumwimerere IC ububiko bwa elegitoronike Ic Chip Inkunga BOM Service TPS22965TDSGRQ1

Gupakira

Nyuma yinzira ndende, kuva mubishushanyo kugeza gukora, amaherezo ubona IC chip.Nyamara, chip ni ntoya kandi yoroheje kuburyo ishobora gutoborwa byoroshye kandi ikangirika iyo idakingiwe.Byongeye kandi, kubera ubunini buke bwa chip, ntabwo byoroshye kubishyira ku kibaho intoki nta nzu nini nini.

Kubwibyo, ibisobanuro byapaki birakurikira.

Hariho ubwoko bubiri bwibipaki, pake ya DIP, ikunze kuboneka mubikinisho byamashanyarazi kandi bisa na centipede yumukara, hamwe na BGA pack, ikunze kuboneka mugihe uguze CPU mumasanduku.Ubundi buryo bwo gupakira burimo PGA (Pin Grid Array; Pin Grid Array) ikoreshwa muri CPU kare cyangwa verisiyo yahinduwe ya DIP, QFP (pake ya plastike kare).

Kuberako hariho uburyo bwinshi bwo gupakira, ibikurikira bizasobanura paki ya DIP na BGA.

Ipaki gakondo yihanganiye imyaka

Ipaki yambere yatangijwe ni Dual Inline Package (DIP).Nkuko mubibona mwishusho hepfo, chip ya IC muriyi paki irasa na centipede yumukara munsi yumurongo wibiri wa pin, birashimishije.Nyamara, kubera ko ahanini bikozwe muri plastiki, ingaruka zo gukwirakwiza ubushyuhe ni mbi kandi ntishobora kuzuza ibisabwa bya chip yihuta.Kubera iyo mpamvu, ubwinshi bwa IC bukoreshwa muriyi paki ni chip-ndende ndende, nka OP741 ku gishushanyo gikurikira, cyangwa IC idasaba umuvuduko mwinshi kandi ifite chip ntoya ifite vias nkeya.

Chip ya IC ibumoso ni OP741, amplifier isanzwe.

IC ibumoso ni OP741, amplifier isanzwe.

Kubijyanye na Ball Grid Array (BGA), ni ntoya kurenza DIP yamashanyarazi kandi irashobora guhuza nibikoresho bito.Mubyongeyeho, kubera ko pin ziri munsi ya chip, ibyuma byinshi birashobora kwakirwa ugereranije na DIP.Ibi bituma biba byiza kuri chipi isaba umubare munini wimibonano.Nyamara, bihenze cyane kandi uburyo bwo guhuza buragoye, kuburyo bukoreshwa cyane mubicuruzwa bihenze.