Ikarita ya elegitoroniki Ifasha BOM Service TPS54560BDDAR ikirango gishya ic chip ibikoresho bya elegitoroniki

1.Kwita izina IC, gupakira ubumenyi rusange namategeko yo kwita izina:

Urwego rw'ubushyuhe.

C = 0 ° C kugeza kuri 60 ° C (urwego rwubucuruzi);I = -20 ° C kugeza 85 ° C (urwego rwinganda);E = -40 ° C kugeza kuri 85 ° C (urwego rwagutse rwinganda);A = -40 ° C kugeza kuri 82 ° C (icyiciro cy'ikirere);M = -55 ° C kugeza kuri 125 ° C (urwego rwa gisirikare)

Ubwoko bw'ipaki.

A-SSOP;B-CERQUAD;C-TO-200, TQFP;D-Ceramic y'umuringa hejuru;E-QSOP;F-Ceramic SOP;H- SBGAJ-Ceramic DIP;K-TO-3;L-LCC, M-MQFP;N-Gufata DIP;N-DIP;Q PLCC;R - DIP Ceramic DIP (300mil);S - TO-52, T - TO5, TO-99, TO-100;U - TSSOP, uMAX, SOT;W - Ikintu Cyinshi Cyimiterere (300mil) W-Ikintu gito cyerekana (300 mil);X-SC-60 (3P, 5P, 6P);Y-Gufata umuringa hejuru;Z-TO-92, MQUAD;D-Gupfa;/ PR-Yongeyeho ingufu za plastiki;/ W-Wafer.

Umubare w'ipine:

a-8;b-10;c-12, 192;d-14;e-16;f-22, 256;g-4;h-4;i -4;H-4;I-28;J-2;K-5, 68;L-40;M-6, 48;N 18;O-42;P-20;Q-2, 100;R-3, 843;S-4, 80;T-6, 160;U-60 -6,160;U-60;V-8 (uruziga);W-10 (uruziga);X-36;Y-8 (uruziga);Z-10 (uruziga).(uruziga).

Icyitonderwa: Inyuguti yambere yinyuguti enye zinyongera zurwego rwimbere ni E, bivuze ko igikoresho gifite imikorere irwanya antistatike.

2.Gutezimbere tekinoroji yo gupakira

Inzira za mbere zahujwe zikoresha ceramic flat pack, zakomeje gukoreshwa nabasirikare imyaka myinshi kubera kwizerwa kwabo nubunini buto.Ibicuruzwa byuzuzanya mubucuruzi bidatinze byimuriwe mubice bibiri kumurongo, bitangirana na ceramic hanyuma plastike, hanyuma mumwaka wa 1980 pin ibara ryumuzunguruko wa VLSI yarenze imipaka yo gusaba ya DIP yamashanyarazi, amaherezo bituma havuka imiyoboro ya pin grid hamwe nabatwara chip.

Igice cyo hejuru cyububiko cyagaragaye muntangiriro yimyaka ya 1980 kandi cyamamaye mugice cyanyuma cyiyo myaka icumi.Ikoresha ikibanza cyiza cya pin kandi ifite amababa-amababa cyangwa J ifite ishusho ya pin.Inzira ntoya-Yuzuye Yuzuzanya (SOIC), kurugero, ifite ubuso buto 30-50% kandi ifite umubyimba wa 70% ugereranije na DIP ihwanye.Iyi paki ifite pin-amababa ameze nk'ibaba risohoka riva mu mpande zombi ndende hamwe n'ikinini cya 0.05 ".

Gitoya-Urucacagu Yuzuzanya (SOIC) hamwe na PLCC.mu myaka ya za 90, nubwo paketi ya PGA yari ikoreshwa kenshi kuri microprocessor yo mu rwego rwo hejuru.pQFP na pake ntoya-yoroheje (TSOP) yahindutse pake isanzwe kubikoresho byinshi byo kubara pin.Intungamubiri za Intel na AMD zohejuru ziva muri pGA (Pine Grid Array) zipakirwa muri Land Grid Array (LGA).

Ibipapuro bya Ball Grid Array byatangiye kugaragara mu myaka ya za 70, naho mu myaka ya za 90 paketi ya FCBGA yatejwe imbere hamwe n’ibara ryinshi kuruta izindi paki.Muri pake ya FCBGA, ipfa riramburwa hejuru hanyuma rihuzwa nudupira twagurishije kuri paki na PCB isa na base base aho kuba insinga.Ku isoko ryiki gihe, ibipfunyika nabyo ubu ni igice cyihariye cyibikorwa, kandi tekinoroji yipaki irashobora no kugira ingaruka kumiterere numusaruro wibicuruzwa.