Umwimerere IC XCKU025-1FFVA1156I Chip Yinjijwe Kumuzunguruko IC FPGA 312 I / O 1156FCBGA
Ibiranga ibicuruzwa
UBWOKO | URUGERO |
icyiciro | Inzira zuzuye (IC) |
uruganda | |
Urukurikirane | |
gupfunyika | ubwinshi |
Imiterere y'ibicuruzwa | Bikora |
DigiKey irashobora gutegurwa | Ntabwo bigenzuwe |
Umubare wa LAB / CLB | 18180 |
Umubare wibintu byumvikana / ibice | 318150 |
Umubare wuzuye wa RAM bits | 13004800 |
Umubare wa I / Os | 312 |
Umuvuduko - Amashanyarazi | 0.922V ~ 0.979V |
Ubwoko bwo kwishyiriraho | |
Ubushyuhe bwo gukora | -40 ° C ~ 100 ° C (TJ) |
Amapaki / Amazu | |
Ibicuruzwa byabacuruzi | 1156-FCBGA (35x35) |
Umubare wibicuruzwa |
Inyandiko & Itangazamakuru
UBWOKO BW'UMUTUNGO | LINK |
Datasheet | |
Amakuru y'ibidukikije | Xiliinx RoHS Icyemezo |
Igishushanyo cya PCN / ibisobanuro | Ultrascale & Virtex Igikoresho cyihariye Chg 20 / Ukuboza / 2016 |
Gutondekanya ibidukikije no kohereza ibicuruzwa hanze
ATTRIBUTE | URUGERO |
Imiterere ya RoHS | Kubahiriza amabwiriza ya ROHS3 |
Urwego rwo Kumva neza Ubushyuhe (MSL) | 4 (amasaha 72) |
SHAKA imiterere | Ntabwo ukurikiza ibisobanuro bya REACH |
ECCN | 3A991D |
HTSUS | 8542.39.0001 |
Kumenyekanisha ibicuruzwa
FCBGA(Flip Chip Ball Grid Array) bisobanura "flip chip ball grid Array".
FC-BGA (Flip Chip Ball Grid Array), ibyo bita imiterere ya flip chip ball grid array format, nuburyo bwimiterere ya pake ya chip yihuta yibishushanyo.Ubu buhanga bwo gupakira bwatangiye mu myaka ya za 1960, ubwo IBM yatangizaga ikoranabuhanga ryitwa C4 (Controlled Collapse Chip Connection) ikoranabuhanga rya mudasobwa nini, hanyuma rikarushaho gutera imbere kugirango rikoreshe uburemere bwikigero cyashongeshejwe kugirango rishyigikire uburemere bwa chip no kugenzura uburebure bwa bulge.Kandi ube icyerekezo cyiterambere cyikoranabuhanga rya flip.
Ni izihe nyungu za FC-BGA?
Icya mbere, irakemuraguhuza amashanyarazi(EMC) nakwivanga kwa electronique (EMI)ibibazo.Muri rusange, kohereza ibimenyetso bya chip ukoresheje tekinoroji yo gupakira ya WireBond bikorwa binyuze mu cyuma gifite uburebure runaka.Mugihe cyumuvuduko mwinshi, ubu buryo buzatanga icyo bita ingaruka ya impedance, bigatera inzitizi kumuhanda wibimenyetso.Ariko, FC-BGA ikoresha pellet aho gukoresha pin kugirango ihuze gutunganya.Iyi paki ikoresha imipira 479 yose, ariko buriwese ufite diameter ya mm 0,78, itanga intera ngufi yo hanze.Gukoresha iyi paki ntabwo itanga gusa imikorere myiza yamashanyarazi, ariko kandi igabanya igihombo nubushake hagati yimikorere ihuza ibice, igabanya ikibazo cyo kwivanga kwa electronique, kandi irashobora kwihanganira imirongo myinshi, kurenga imipaka irenga birashoboka.
Icya kabiri, nkuko kwerekana chip bashushanya bashizemo imirongo myinshi kandi yuzuye murwego rumwe rwa silicon kristal, umubare winjiza nibisohoka hamwe na pin biziyongera byihuse, kandi ikindi cyiza cya FC-BGA nuko gishobora kongera ubucucike bwa I / O. .Muri rusange, I / O iyobora ikoresheje tekinoroji ya WireBond itunganijwe hafi ya chip, ariko nyuma yipaki ya FC-BGA, I / O iyobora irashobora gutondekwa mumurongo hejuru ya chip, itanga ubucucike bukabije I / O. imiterere, bivamo gukoresha neza imikorere, kandi kubera iyi nyungu.Tekinoroji yo guhinduranya igabanya akarere 30% kugeza kuri 60% ugereranije nuburyo bwo gupakira.
Hanyuma, mu gisekuru gishya cyihuta cyane, cyerekanwe cyane cyerekana chip, ikibazo cyo gukwirakwiza ubushyuhe kizaba ikibazo gikomeye.Ukurikije flip pack idasanzwe ya FC-BGA, inyuma ya chip irashobora guhura numwuka kandi irashobora gukwirakwiza ubushyuhe.Muri icyo gihe, substrate irashobora kandi kunoza uburyo bwo gukwirakwiza ubushyuhe binyuze mucyuma, cyangwa igashyiraho icyuma gishyushya ibyuma inyuma ya chip, bikarushaho gushimangira ubushobozi bwo gukwirakwiza ubushyuhe bwa chip, kandi bikazamura cyane ituze rya chip ku buryo bwihuse.
Bitewe nibyiza bya pack ya FC-BGA, amakarita yihuta yikarita yihuta yapakiwe hamwe na FC-BGA.