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ibicuruzwa

Umwimerere IC XCKU025-1FFVA1156I Chip Yinjijwe Kumuzunguruko IC FPGA 312 I / O 1156FCBGA

ibisobanuro bigufi:

Kintex® UltraScale ™ Field Programmable Gate Array (FPGA) IC 312 13004800 318150 1156-BBGA 、 FCBGA


Ibicuruzwa birambuye

Ibicuruzwa

Ibiranga ibicuruzwa

UBWOKO

URUGERO

icyiciro

Inzira zuzuye (IC)

Byashyizwemo

Umwanya wo gutangiza amarembo yumurongo (FPGAs)

uruganda

AMD

Urukurikirane

Kintex® UltraScale ™

gupfunyika

ubwinshi

Imiterere y'ibicuruzwa

Bikora

DigiKey irashobora gutegurwa

Ntabwo bigenzuwe

Umubare wa LAB / CLB

18180

Umubare wibintu byumvikana / ibice

318150

Umubare wuzuye wa RAM bits

13004800

Umubare wa I / Os

312

Umuvuduko - Amashanyarazi

0.922V ~ 0.979V

Ubwoko bwo kwishyiriraho

Ubwoko bwo gufatira hejuru

Ubushyuhe bwo gukora

-40 ° C ~ 100 ° C (TJ)

Amapaki / Amazu

1156-BBGAFCBGA

Ibicuruzwa byabacuruzi

1156-FCBGA (35x35)

Umubare wibicuruzwa

XCKU025

Inyandiko & Itangazamakuru

Gutondekanya ibidukikije no kohereza ibicuruzwa hanze

ATTRIBUTE

URUGERO

Imiterere ya RoHS

Kubahiriza amabwiriza ya ROHS3

Urwego rwo Kumva neza Ubushyuhe (MSL)

4 (amasaha 72)

SHAKA imiterere

Ntabwo ukurikiza ibisobanuro bya REACH

ECCN

3A991D

HTSUS

8542.39.0001

Kumenyekanisha ibicuruzwa

FCBGA(Flip Chip Ball Grid Array) bisobanura "flip chip ball grid Array".

FC-BGA (Flip Chip Ball Grid Array), ibyo bita imiterere ya flip chip ball grid array format, nuburyo bwimiterere ya pake ya chip yihuta yibishushanyo.Ubu buhanga bwo gupakira bwatangiye mu myaka ya za 1960, ubwo IBM yatangizaga ikoranabuhanga ryitwa C4 (Controlled Collapse Chip Connection) ikoranabuhanga rya mudasobwa nini, hanyuma rikarushaho gutera imbere kugirango rikoreshe uburemere bwikigero cyashongeshejwe kugirango rishyigikire uburemere bwa chip no kugenzura uburebure bwa bulge.Kandi ube icyerekezo cyiterambere cyikoranabuhanga rya flip.

Ni izihe nyungu za FC-BGA?

Icya mbere, irakemuraguhuza amashanyarazi(EMC) nakwivanga kwa electronique (EMI)ibibazo.Muri rusange, kohereza ibimenyetso bya chip ukoresheje tekinoroji yo gupakira ya WireBond bikorwa binyuze mu cyuma gifite uburebure runaka.Mugihe cyumuvuduko mwinshi, ubu buryo buzatanga icyo bita ingaruka ya impedance, bigatera inzitizi kumuhanda wibimenyetso.Ariko, FC-BGA ikoresha pellet aho gukoresha pin kugirango ihuze gutunganya.Iyi paki ikoresha imipira 479 yose, ariko buriwese ufite diameter ya mm 0,78, itanga intera ngufi yo hanze.Gukoresha iyi paki ntabwo itanga gusa imikorere myiza yamashanyarazi, ariko kandi igabanya igihombo nubushake hagati yimikorere ihuza ibice, igabanya ikibazo cyo kwivanga kwa electronique, kandi irashobora kwihanganira imirongo myinshi, kurenga imipaka irenga birashoboka.

Icya kabiri, nkuko kwerekana chip bashushanya bashizemo imirongo myinshi kandi yuzuye murwego rumwe rwa silicon kristal, umubare winjiza nibisohoka hamwe na pin biziyongera byihuse, kandi ikindi cyiza cya FC-BGA nuko gishobora kongera ubucucike bwa I / O. .Muri rusange, I / O iyobora ikoresheje tekinoroji ya WireBond itunganijwe hafi ya chip, ariko nyuma yipaki ya FC-BGA, I / O iyobora irashobora gutondekwa mumurongo hejuru ya chip, itanga ubucucike bukabije I / O. imiterere, bivamo gukoresha neza imikorere, kandi kubera iyi nyungu.Tekinoroji yo guhinduranya igabanya akarere 30% kugeza kuri 60% ugereranije nuburyo bwo gupakira.

Hanyuma, mu gisekuru gishya cyihuta cyane, cyerekanwe cyane cyerekana chip, ikibazo cyo gukwirakwiza ubushyuhe kizaba ikibazo gikomeye.Ukurikije flip pack idasanzwe ya FC-BGA, inyuma ya chip irashobora guhura numwuka kandi irashobora gukwirakwiza ubushyuhe.Muri icyo gihe, substrate irashobora kandi kunoza uburyo bwo gukwirakwiza ubushyuhe binyuze mucyuma, cyangwa igashyiraho icyuma gishyushya ibyuma inyuma ya chip, bikarushaho gushimangira ubushobozi bwo gukwirakwiza ubushyuhe bwa chip, kandi bikazamura cyane ituze rya chip ku buryo bwihuse.

Bitewe nibyiza bya pack ya FC-BGA, amakarita yihuta yikarita yihuta yapakiwe hamwe na FC-BGA.


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