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ibicuruzwa

XCVU9P-2FLGB2104I FPGA, VIRTEX ULTRASCALE, FCBGA-2104

ibisobanuro bigufi:

Ubwubatsi bwa XCVU9P-2FLGB2104I bugizwe nimiryango ikora cyane ya FPGA, MPSoC, na RFSoC ikemura ibibazo byinshi bya sisitemu yibanda ku kugabanya ingufu zose zikoreshwa mumashanyarazi hifashishijwe iterambere ryinshi ryikoranabuhanga.


Ibicuruzwa birambuye

Ibicuruzwa

Amakuru y'ibicuruzwa

TYPENo.ya Logic Block:

2586150

Oya ya Macrocells:

2586150Macrocells

Umuryango wa FPGA:

Virtex UltraScale Urukurikirane

Uburyo bwumvikana:

FCBGA

Oya ya pin:

2104

Oya y'ibyiciro byihuta:

2

Bits ya RAM yose:

77722Kbit

Oya ya I / O:

778I / O.

Gucunga amasaha:

MMCM, PLL

Amashanyarazi Yibanze Amashanyarazi Min:

922mV

Amashanyarazi Yibanze Yibanze:

979mV

I / O Gutanga Umuvuduko:

3.3V

Gukoresha inshuro nyinshi:

725MHz

Urutonde rw'ibicuruzwa:

Virtex UltraScale XCVU9P

MSL:

-

Kumenyekanisha ibicuruzwa

BGA bisobanuraImipira yumupira Q Array.

Ububiko bukubiye mu buhanga bwa BGA burashobora kongera ubushobozi bwo kwibuka inshuro eshatu udahinduye ingano yububiko, BGA na TSOP

Ugereranije na, ifite ingano ntoya, imikorere myiza yo gukwirakwiza ubushyuhe nibikorwa byamashanyarazi.Tekinoroji yo gupakira BGA yazamuye cyane ubushobozi bwo kubika kuri santimetero kare, ikoresheje ibikoresho bya BGA bipfunyika ibikoresho byo kwibuka mubushobozi bumwe, ingano ni kimwe cya gatatu cyibikoresho bya TSOP;Byongeye, hamwe na gakondo

Ugereranije na pake ya TSOP, paketi ya BGA ifite uburyo bwihuse kandi bunoze bwo gukwirakwiza ubushyuhe.

Hamwe niterambere ryiterambere rya tekinoroji yumuzunguruko, ibisabwa byo gupakira byumuzunguruko uhuriweho birakomeye.Ni ukubera ko tekinoroji yo gupakira ifitanye isano nimikorere yibicuruzwa, mugihe inshuro ya IC irenze 100MHz, uburyo bwa gakondo bwo gupakira bushobora kubyara icyo bita "Cross Talk • phenomenon, kandi mugihe umubare wibipapuro bya IC ari irenze 208 Pin, uburyo bwa gakondo bwo gupakira bufite ibibazo byabwo.Nuko rero, usibye gukoresha ibikoresho bya QFP bipfunyika, ibyinshi muri chip yo kubara pin yo muri iki gihe (nkibishushanyo mbonera na chipeti, nibindi) byahinduwe kuri BGA (Ball Grid Array PackageQ) tekinoroji yo gupakira.BGA imaze kugaragara, yabaye ihitamo ryiza kubucucike bwinshi, bukora cyane, ipaki nyinshi nka cpus hamwe na chipi yikiraro cyamajyepfo / Amajyaruguru kurubaho.

Tekinoroji yo gupakira BGA irashobora kandi kugabanywamo ibyiciro bitanu:

1.PBGA (Plasric BGA) substrate: Mubisanzwe ibice 2-4 byibikoresho ngengabuzima bigizwe nimbaho ​​nyinshi.Intel ikurikirana CPU, Pentium 1l

Chuan IV itunganya byose byapakiwe murubu buryo.

2.CBGA (CeramicBCA) substrate: ni ukuvuga substrate ceramic, guhuza amashanyarazi hagati ya chip na substrate mubisanzwe ni flip-chip

Nigute ushobora gushiraho FlipChip (FC muri make).Intel ikurikirana cpus, Pentium l, ll Pentium Pro ikoreshwa

Uburyo bwo gukuramo.

3.FCBGA(FilpChipBGA) substrate: Gukomera kwinshi.

4.TBGA (TapeBGA) substrate: Substrate ni lente yoroshye 1-2 layer PCB yumuzunguruko.

5.CDPBGA (Carty Down PBGA) substrate: bivuga agace gato ka chip agace (nanone kazwi nka cavity area) hagati muri paki.

Porogaramu ya BGA ifite ibintu bikurikira:

1) .10 Umubare wa pin wiyongereye, ariko intera iri hagati yinini irarenze cyane iy'ibipfunyika bya QFP, biteza imbere umusaruro.

2) .Nubwo gukoresha ingufu za BGA byiyongereye, imikorere yo gushyushya amashanyarazi irashobora kunozwa kubera uburyo bwo gusudira chip yo kugenzura.

3).Gutinda kohereza ibimenyetso ni bito, kandi imiterere yo guhuza n'imikorere iratera imbere cyane.

4).Inteko irashobora gusudira coplanar, itezimbere cyane kwizerwa.


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