Intangiriro kuri wafer Inyuma yo Gusya
1. Intego yo Gusya Inyuma
Muburyo bwo gukora semiconductor kuva muri wafers, isura ya wafer ihora ihinduka.Ubwa mbere, mubikorwa byo gukora wafer, Impande nubuso bwa wafer birasukuye, inzira isanzwe isya impande zombi za wafer.Nyuma yo kurangiza inzira yimbere-iherezo, urashobora gutangira inzira yo gusya yinyuma isya gusa inyuma ya wafer, ishobora gukuraho imiti yanduye muburyo bwimbere kandi ikagabanya umubyimba wa chip, ibereye cyane kubikorwa byo gukora chip yoroheje yashyizwe kumarita ya IC cyangwa ibikoresho bigendanwa.Byongeye kandi, iki gikorwa gifite ibyiza byo kugabanya guhangana, kugabanya gukoresha ingufu, kongera ubushyuhe bwumuriro no gukwirakwiza ubushyuhe vuba inyuma ya wafer.Ariko icyarimwe, kubera ko wafer yoroheje, biroroshye kumeneka cyangwa gutwarwa nimbaraga zo hanze, bigatuma intambwe yo gutunganya igorana.
2. Gusya Inyuma (Gusya Inyuma) inzira irambuye
Gusya inyuma birashobora kugabanywamo intambwe eshatu zikurikira: icya mbere, shyira kurinda Tape Lamination kuri wafer;Icya kabiri, gusya inyuma ya wafer;Icya gatatu, mbere yo gutandukanya chip na Wafer, wafer igomba gushyirwa kumusozi wa Wafer urinda kaseti.Inzira ya wafer ni inzira yo gutegura gutandukanyachip(gukata chip) bityo rero irashobora no gushyirwa mubikorwa byo guca.Mu myaka yashize, nkuko chip zimaze kuba nto, urutonde rwibikorwa narwo rushobora guhinduka, kandi intambwe yimikorere yarushijeho kunonosorwa.
3. Tape Lamination inzira yo kurinda wafer
Intambwe yambere mugusya inyuma ni coating.Nibikorwa byo gutwikira bifata kaseti imbere ya wafer.Iyo usya inyuma, ibice bya silikoni bizakwira hirya no hino, kandi wafer irashobora kandi guturika cyangwa guturika bitewe nimbaraga zo hanze muriki gikorwa, kandi nubunini bunini bwa wafer, niko byoroha cyane kuri iki kintu.Kubwibyo, mbere yo gusya inyuma, firime yubururu Ultra Violet (UV) ifatanye kugirango irinde wafer.
Iyo ukoresheje firime, kugirango hatabaho icyuho cyangwa umwuka mubi hagati ya wafer na kaseti, birakenewe kongera imbaraga zifatika.Ariko, nyuma yo gusya inyuma, kaseti iri kuri wafer igomba gucanwa numucyo ultraviolet kugirango igabanye imbaraga zifatika.Nyuma yo kwiyambura, ibisigazwa bya kaseti ntibigomba kuguma hejuru ya wafer.Rimwe na rimwe, inzira izakoresha imbaraga zidakomeye kandi ikunda kubyimba itari ultraviolet igabanya imiti ivura membrane, nubwo ibibi byinshi, ariko bihendutse.Mubyongeyeho, Bump firime, zifite ubunini bwikubye kabiri kugabanya UV kugabanya, nazo zirakoreshwa, kandi biteganijwe ko zizakoreshwa hamwe no kongera inshuro nyinshi mugihe kizaza.
4. Ubunini bwa wafer buringaniye butandukanye na chip pack
Ubunini bwa Wafer nyuma yo gusya inyuma buragabanuka kuva 800-700 µm kugeza 80-70 µm.Wafers yamanutse kugeza kumi icumi irashobora guteranya ibice bine kugeza kuri bitandatu.Vuba aha, wafer irashobora no kunanurwa kugera kuri milimetero 20 hakoreshejwe uburyo bwo gusya kabiri, bityo ukayishyira kuri 16 kugeza 32, imiterere ya semiconductor igizwe ninshi izwi nka pack ya chip nyinshi (MCP).Muri iki kibazo, nubwo hakoreshwa ibice byinshi, uburebure bwuzuye bwa paki yarangiye ntibugomba kurenza umubyimba runaka, niyo mpamvu gusya byoroheje gusya byahora bikurikiranwa.Inzitizi ya wafer yoroheje, inenge zirahari, kandi inzira ikurikira iragoye.Kubwibyo, tekinoroji igezweho irakenewe kugirango iki kibazo gikosorwe.
5. Guhindura uburyo bwo gusya inyuma
Mugukata waferi yoroheje ishoboka kugirango tuneshe imbogamizi zubuhanga bwo gutunganya, tekinoroji yo gusya inyuma ikomeza gutera imbere.Kuri waferi isanzwe ifite umubyimba wa 50 cyangwa irenga, Gusya inyuma bikubiyemo intambwe eshatu: Gusya gukabije hanyuma gusya neza, aho wafer yaciwe kandi igasukurwa nyuma yamasomo abiri yo gusya.Kuri ubu, bisa na Himiki Mechanical Polishing (CMP), Amazi ya Slurry na Deionized akunze gukoreshwa hagati ya pisine na wafer.Aka kazi ko gusya karashobora kugabanya ubushyamirane buri hagati ya wafer na padi, kandi bigatuma ubuso bwaka.Iyo wafer ari ndende, Gukoresha super Fine Gusya birashobora gukoreshwa, ariko uko wafer yoroheje, niko bisabwa cyane.
Niba wafer ihindutse yoroheje, ikunze kugaragaramo inenge zo hanze mugihe cyo gutema.Kubwibyo, niba umubyimba wa wafer ari 50 µm cyangwa munsi, inzira ikurikirana irashobora guhinduka.Muri iki gihe, uburyo bwa DBG (Dices Mbere yo Gusya) burakoreshwa, ni ukuvuga, wafer yaciwemo kabiri mbere yo gusya bwa mbere.Chip yatandukanijwe neza na wafer muburyo bwa Dices, gusya, no gukata.Mubyongeyeho, hariho uburyo bwihariye bwo gusya bukoresha isahani ikomeye yikirahure kugirango wirinde wafer kumeneka.
Hamwe nogushaka gukenera kwishyira hamwe muri miniaturizasi yibikoresho byamashanyarazi, tekinoroji yo gusya inyuma ntigomba gutsinda gusa aho igarukira, ahubwo igomba no gutera imbere.Muri icyo gihe, ntabwo ari ngombwa gukemura gusa ikibazo cyinenge ya wafer, ahubwo no gutegura ibibazo bishya bishobora kuvuka mugihe kizaza.Kugirango ukemure ibyo bibazo, birashobora kuba ngombwahindurainzira ikurikirana, cyangwa kumenyekanisha tekinoroji ya chimique ikoreshwa kuriigice cya kabiriinzira-iherezo, kandi itezimbere byuzuye uburyo bushya bwo gutunganya.Kugirango dukemure inenge zavutse zahantu hanini, harashakishwa uburyo butandukanye bwo gusya.Byongeye kandi, ubushakashatsi burimo gukorwa ku buryo bwo gutunganya icyuma cya silicon cyakozwe nyuma yo gusya wafer.
Igihe cyo kohereza: Nyakanga-14-2023